ULTCC6G_EPac

The main objective of the project is to develop novel functional materials based on advanced multilayer technology (ULTCC), characterize their properties (e.g., electrical), and demonstrate and validate ULTCC-based telecommunication devices.

• Jan 22–24, 2025 — San Juan, PR 5th MTT-S Latin America Microwave Conference (LAMC 2025)
• Jan 19–22, 2025 — San Juan, PR IEEE Radio & Wireless Week (RWW 2025)
• Aug 11–14, 2024 — Montreal, CA IEEE MTT-S NEMO 2024
• Jul 1–4, 2024 — Wrocław, PL The 11th Microwave & Radar Week (MIKON)
• Jun 16–21, 2024 — Washington, DC, US IEEE International Microwave Symposium (IMS 2024)
• Jun 3–5, 2024 — Namur, BE INDTech – Conference on Industrial Technologies
• Jun 4, 2024 — Warsaw, PL Space Sector Forum
• Apr 9–11, 2024 — Anaheim, US IPC APEX EXPO 2024
• Oct 25–27, 2023 — Taipei, TW 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
• Sep 25–28, 2023 — Mainz, DE 12th International Conference on Microwave Materials & their Applications (MMA 2023)
• Sep 11–14, 2023 — Cardiff, UK 19th International Conference on Microwave and High-Frequency Applications (AMPERE 2023)
• Jun 28–30, 2023 — Winnipeg, CA IEEE MTT-S NEMO 2023
• Jun 27–29, 2023 — Denver, US 57th Annual Microwave Power Symposium (IMPI 57)
• Jun 11–16, 2023 — San Diego, US International Microwave Symposium (IMS 2023)
• May 8–12, 2023 — Noordwijk, NL 1st Space Microwave Week
• Apr 26–28, 2023 — Vienna, AT 4th EMMC International Workshop
• Jan 22–25, 2023 — Las Vegas, US IEEE RWW: Invited Talk – Women in Microwaves
• Jan 18–20, 2023 — Orlando, US ACerS – Electronic Materials & Applications (EMA 2023)
• Nov 14–18, 2022 — Online IEEE Ukrainian Microwave Week (UkrMW) – Invited Lecture, Women in Engineering
• Sep 26–29, 2022 — Milan, IT 52nd European Microwave Week (EuMW 2022)
• Sep 12–15, 2022 — Gdańsk, PL 24th International Microwave and Radar Conference (MIKON 2022)
• Jun 19–24, 2022 — Denver, US International Microwave Symposium (IMS 2022)
• Jun 14–16, 2022 — Savannah, US 56th Annual Microwave Power Symposium (IMPI 56)

1. J. Koper, M. Celuch, M. Olszewska-Płacha, P. Korpas, “A Comparative Study of Deblurring Methods for Dielectric Resonator Scans of Material Surfaces,” NEMO 2024, Montreal, Aug 12–14, 2024.
2. M. Olszewska-Płacha, J. Varghese, B. Synkiewicz-Musialska, “Microwave and THz characterization of dielectric properties of bulk glass-ceramic composites and ULTCC substrates,” MIKON 2024, Wrocław, July 1–4, 2024. DOI: 10.23919/MIKON60251.2024.10633917.
3. J. Koper, M. Celuch, M. Olszewska-Płacha, P. Korpas, “Evaluation of Image Restoration Technique for Dielectric Resonator Mapping of Materials,” MIKON 2024, Wrocław, July 1–4, 2024, 228–231.
4. M. Celuch, M. Olszewska-Płacha, Ł. Nowicki, W. Gwarek, “A Novel Q-Choked Resonator for Microwave Material Measurements Alleviating Sample Thickness Limitations of Existing Techniques,” IEEE MWTL 34(6):845–848, June 2024. doi:10.1109/LMWT.2024.3397912.
5. M. Olszewska-Płacha, “2D Scanner for Surface-Wise Measurements of Complex Permittivity of Emerging LTCC and ULTCC Materials,” IMS 2024 MicroApps TUMA2, Jun 18, 2024.
6. M. Olszewska-Płacha, J. Varghese, B. Synkiewicz-Musialska, “GHz and THz Characterization of Novel ULTCC Materials for Emerging Technologies,” IMPI 58, Reston, May 29–31, 2024, pp.112–114.
7. M. Celuch, M. Olszewska-Płacha, Ł. Nowicki, P. Kopyt, J. Cuper, “Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators,” IPC APEX EXPO, Anaheim, Apr 9, 2024.
8. M. Olszewska-Płacha, J. Varghese, D. Szwagierczak, M. Birgit, S. Ziesche, J. Rudnicki, B. Synkiewicz-Musialska, “Bulk glass-ceramic composites and ULTCC substrates for microwave and millimetre-wave applications,” Materials Research Bulletin 177 (2024) 112862.
9. M. Olszewska-Płacha et al., “Microwave and THz Characterization of Dielectric Properties of New ULTCC Materials for 5G and 6G Systems,” MMA 2023, Sep 28, 2023.
10. Presentation: B. Salski, M. Olszewska-Płacha, P. Czekała, “Microwave Characterization of Liquids with Resonant Methods,” IMPI 57, Denver, Jun 27–29, 2023.
11. Presentation: “Modelling-based large surface testing of LTCC and ULTCC substrates for antenna array design,” NEMO 2023, Canada, Jun 28, 2023.
12. S. Phommakesone, L. Enright, M. Olszewska-Płacha, U. Ray, “mmWavePermittivity Standard Reference Material Development,” IMS Industry Workshop IWWE6, Jun 14, 2023.
13. Presentation: “Advances in Computational Modeling and Materials Characterization for the Microwave Power Industry,” IMS 2023 WMG-4 Workshops, Jun 12, 2023.
14. Presentation: “Benchmarking of Current Industrial Best Practices and Emerging Techniques for the Consistent Electric and Dielectric Characterisation of Materials from Microwave to Millimetre Wave Ranges,” Space Microwave Week 2023, May 8–12, 2023.
15. Presentation: “From Computational Electromagnetics to Modelling Based Characterisation of Materials for Electronic and Energy Technologies,” EMMC 2023, Apr 26–28, 2023.
16. Poster: “Twinned Modelling–Characterisation (MODA-CHADA) Solutions…,” EMMC 2023, Apr 26–28, 2023.
17. Presentation: “Modelling Based Characterisation of Materials from Micro to Millimetre Waves,” IEEE RWW – WiM, Jan 22, 2023.
18. Presentation: “Evaluation and extensions of resonator techniques for the characterization of ceramics and energy materials relevant to 6G applications,” EMA 2023, Jan 19, 2023.
19. Presentation: “Microwave characterisation and modelling of materials in European initiative,” UkrMW 2022, Nov 14–18, 2022.
20. ULTCC6G_EPac information leaflet — EuMW 2022, Milan, Sep 26–29, 2022.
21. M. Olszewska-Płacha, D. Szwagierczak, B. Synkiewicz-Musialska, J. Rudnicki, J. Kulawik, “GHz Characterisation of dielectric properties of ultra-low temperature co-fired ceramic materials for 6G systems application,” MIKON 2022, Gdańsk, Sep 12–14, 2022 — poster.
22. M. Olszewska-Płacha, D. Szwagierczak, B. Synkiewicz-Musialska, “Simulation-based resonant material measurement technique for precise characterization of LTCC and ULTCC materials towards 5G applications,” NEMO 2022, Limoges, July 6–8, 2022 — abstract.
23. Presentation: B. Salski, M. Olszewska-Płacha, “FDTD modeling of microwave power applicators,” IMPI 56, Savannah, Jun 14–16, 2022.
24. M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Płacha, S. Phommakesone, U. Ray, B. Salski, “Benchmarking of GHz resonator techniques for the characterisation of 5G/mmWave materials,” EuMC 2022, London, Apr 2–6, 2022, 568–571 (© EuMA).
25. M. Olszewska-Płacha, M. Celuch, “5G Electronics: Bridging the measurement challenges,” IMAPS Device Packaging, Mar 7–10, 2022.
26. Presentation: M. Celuch, M. Olszewska-Płacha, J. Rudnicki, “Simulation-based resonant imaging of electronic materials for enhanced design in 5G and other emerging technologies,” EMA 2022 (virtual), Jan 19–21, 2022.
27. Presentation: M. Olszewska-Płacha, “Computer modelling — a virtual laboratory for emerging technologies,” IEEE Day 2021, Poland, Oct 2021.

ULTCC6G_EPac is co-funded by the Polish National Centre for Research and Development under the M-ERA.NET2/2020/1/2021 contract. M-ERA.NET 2 received funding from the EU’s Horizon 2020 program (Grant No. 685451).

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