We’re excited to share that our 5G Foil project partner Circuit Foil will be exhibiting at DesignCon 2025 the premier event for high-speed design engineers, held in Santa Clara, California, from 28–30 January 2025.

Visit Booth 213 — Where Innovation Meets Performance

At DesignCon, Circuit Foil will showcase its next-generation copper solutions developed for advanced 5G, high-speed, and high-frequency applications.
These materials play a crucial role in achieving superior signal integrity, thermal management, and electromagnetic performance all essential factors for tomorrow’s connected world.

Collaborate and Connect

Visitors are invited to explore how Circuit Foil’s expertise supports sustainable innovation in materials for modern communication technologies.
Meet the team at Booth 213 to discuss how copper foil technologies can enhance your designs and accelerate progress in 5G electronics.

Together with our partners, we continue to push the boundaries of what’s possible in the 5G Foil project transforming research into real-world performance.