On 6 October 2025, representatives of the 5G Foil project attended IEEE Eurocon 2025 in Gdynia, Poland, where Dr. Adam Łamecki presented a poster titled:
“Electromagnetic Modelling of Metallic Materials for Applications in Manufacturing of Circuit Foils.”

Advanced Modelling of Real-World Copper Surfaces

The presented work introduces a novel full-wave electromagnetic simulation approach for determining the effective electrical conductivity of copper foils featuring real-world surface roughness.
These surfaces were digitally reconstructed from atomic force microscopy (AFM) scans, enabling realistic modelling of microscopic texture and its impact on high-frequency performance.

Using InventSim software, the team applied a unique mesh deformation technique that allows simultaneous modelling of surface and bulk conductor properties, including skin-effect penetration and field distribution within the conductor.
This provides valuable insight into how manufacturing parameters influence RF losses and signal integrity in next-generation electronic circuits.

Research Framework

The study is part of the EUREKA – Eurostars project “5G_Foil”, co-funded by the Polish National Centre for Research and Development (NCBR) under contract InnovativeSMEs/4/90/5G_Foil/2023.
The project aims to advance material and electromagnetic modelling methodologies that underpin the design and manufacturing of high-performance 5G and beyond interconnects.