Event spotlight

DesignCon 2025 - Santa Clara, California

DesignCon is the premier high-speed communications and system design conference and exposition, delivering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. Meet our 5G_Foil project partner Circuit Foil Luxembourg at Booth 213.

Find Circuit Foil Luxembourg: Exhibit Halls A–D • Booth 213 (DesignCon Expo)

Dates

28–30 January 2025

Venue

Santa Clara Convention Center, Santa Clara, CA (Silicon Valley)

Booth

213 • Exhibit Halls A–D

About DesignCon

High-speed design focus

Signal integrity, power integrity, packaging, interconnects, and system-level design for modern electronics.

Education + expo

A conference program paired with an exposition where engineers connect with suppliers and see the newest tools and materials.

Silicon Valley hub

A central meeting point for chip, board, and systems designers across the global high-speed ecosystem.

Official event pageDesignCon

Learn more about the conference, expo, travel info, and updates on the official website.

Open DesignCon website Explore our projects

What to discuss at Booth 213

Advanced copper foils for high-speed & 5G

Materials engineered to support low-loss interconnects, robust thermal behavior, and dependable performance for next-generation electronics.

From materials to measurable performance

Connect foil choices to system outcomes: insertion loss, impedance control, processing variability, and repeatability across manufacturing.

Meet our partner at DesignCon

Exhibit location

Exhibit Halls A–D • Booth 213

Partner

Circuit Foil Luxembourg (5G_Foil)

Topics

Copper foils • high-speed interconnects • RF/microwave loss • manufacturability

Let’s connect

Want to align a technical discussion around high-speed materials, measurement, or project collaboration? Reach out and we’ll coordinate the best way to connect.

Contact QWED DesignCon details