Industry Consortium • Materials & Test

iNEMI — International Electronics Manufacturing Initiative

QWED is a member of iNEMI and participates in projects focused on 5G/6G mmWave materials assessment and characterization.

Focus: 5G/6G • mmWave Areas: Materials • Metrology • Roadmaps
iNEMI logo

Overview & Objectives

The goal is to develop a guideline / best practice for a standardized measurement and test methodology to be shared with industry and standards bodies. Initial focus: benchmarking current methods with pro/con analysis, identifying gaps for 5G/mmWave, and developing reliable reference standard materials for setup and calibration.

Project phases 1) Develop technical guidelines & best practices for ultra-low-loss laminates (5–100 GHz) • 2) Extend guidelines to PCB/substrate-level characterization.
QWED’s roleMaterial characterization techniques & devices; as needed, electromagnetic and multiphysics modelling (QuickWave) to meet project goals.
iNEMI

Articles, Presentations & Posters

  1. M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Płacha, S. Phommakesone, U. Ray, B. Salski, “Benchmarking of GHz resonator techniques for the characterisation of 5G/mmWave materials”, 51st European Microwave Conference (EuMC), London, 2–6 Apr 2022, pp. 568–571.
  2. M. Olszewska-Płacha, M. Celuch, “5G Electronics: bridging the measurements challenges”, 18th International Conference on Device Packaging, 7–10 Mar 2022 (Session: 5G/MMWAVE PACKAGING).
  3. Presentation: M. Olszewska-Płacha, M. Celuch, J. Rudnicki, “Simulation-based resonant imaging of electronic materials for enhanced design in 5G and other emerging technologies”, Electronic Materials and Applications (EMA 2022, virtual), 19–21 Jan 2022.
  4. M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Płacha, S. Phommakesone, U. Ray, B. Salski, “Bridging the materials permittivity traceability gap for 5G applications”, IEEE AP-S 2021, 4–10 Dec 2021 — accepted version.
  5. Presentation: M. Olszewska-Płacha, M. Celuch, “Recent developments of resonator measurements for emerging materials and technologies”, 17th International Conference on Device Packaging, 12–15 Apr 2021 (Session: 5G Electronics Challenges: High Frequency Materials Characterization).
  6. Presentation: M. Celuch, M. Olszewska-Płacha, J. Rudnicki, “How to support 5G materials measurements, antenna designs, and standards developments with QuickWave simulations”, Electronic Materials and Applications (EMA 2021), 19–22 Jan 2021.

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