1st Pan-European Electronics Design Conference (PEDC)
PEDC 2025 — Pan-European Electronics Design Conference
We were proud to participate in the inaugural edition — Design Meets AI: Innovating Electronics — co-organized by FED and IPC.
At our booth
Conversations that mattered
We met brilliant engineers, researchers and product leaders, exchanging ideas on AI-assisted design, EM–thermal co-simulation, and material-aware PCB workflows.
Thank you, organizers
A special thank-you to Dr. Peter Tranitz for invaluable support throughout the event.
Our contribution
Enhanced Modeling and Characterization of Copper Foils for PCB Design
We presented practical methods for linking frequency-dependent conductivity and surface roughness to PCB loss, enabling better correlation between simulation and measurement.
Session chaired by Igor Bulavitchi — many thanks for the engaging Q&A.
Key takeaways
Let’s keep the conversation going
If you’d like a follow-up on EM-aware PCB workflows, copper-foil characterization, or AI-assisted design pipelines, we’re happy to share more details.
