18th International Microsystems, Packaging, Assembly and Circuits Technology Conference
IMPACT 2023 — International Microsystems, Packaging, Assembly & Circuits Technology Conference
We joined Taiwan’s leading PCB & packaging week with a talk on copper-foil characterization for 5G applications.
Our presentation
Reliability & Loss Properties of Copper Foils for 5G Applications — Electrical Characterization with mmWave Resonators
Speaker: Dr. Małgorzata Celuch (QWED)
Date & time: Wed, 25 Oct 2023 · 13:30–15:30
Session chairs: Masahiro Tsuriya (iNEMI) • Jeffrey Lee (IST)
The talk reported iNEMI study results and QWED’s mmWave resonator methods for evaluating copper-foil conductivity without fabricating test circuits — isolating copper loss from substrate effects.
What we presented
Methods & instruments
Easy-to-use resonator heads quantified effective conductivity and loss over 13–40 GHz, with extensions underway toward higher frequencies.
Why it matters
The workflows support copper-foil manufacturers in improving quality and accelerating new product development for mmWave-ready PCBs.
Key takeaways
Let’s keep in touch
Interested in mmWave resonator testing or correlating foil properties with PCB performance? We’re happy to share datasets and demo measurements.
