EIPC Summer Conference ESA-ESTEC,
June 4-5, 2024
We are pleased to announce the upcoming Technical Summer Conference, set to take place on June 4-5, 2024, in Luxembourg. Hosted at the DoubleTree by Hilton Hotel in Luxembourg City, the event will bring together professionals from across the European interconnection and packaging industry for two days of knowledge-sharing, networking, and technical insight.
Conference Highlights
Expert presentations and panel discussions
Participation from leading figures in the PCB and electronics sectors
Opportunities to explore current trends, challenges, and innovations
Circuit Foil Facility Visit
On the afternoon of February 4, attendees will be invited to a guided tour of Circuit Foil — a global leader in copper foil manufacturing.
Circuit Foil, headquartered in Wiltz, Luxembourg, serves a worldwide customer base through an extensive network of service centers and sales offices. The tour will provide valuable insights into their advanced production technologies and materials used in the PCB industry.
Evening Networking Dinner
Following the facility tour, all attendees are welcome to join an exclusive dinner in a prestigious restaurant located in the heart of Luxembourg City. This evening event will offer a relaxed atmosphere for continued networking and informal discussion.
About EIPC
The European Institute for the PCB Community (EIPC) is a growing international service provider to the European interconnection and packaging industry.
Since 1968, EIPC has served over 120 member companies, including:
PCB manufacturers
OEMs
Suppliers of equipment, materials, and software tools
EIPC offers a highly effective platform for senior management, business owners, and technical leaders to stay informed about key developments and technological advances shaping the industry.
